[1]刘棣华.粘弹阻尼减振降噪应用技术 [M].北京:宇航出版社,1990.1015.
[2]Masao Sumita, Hironori Gohda. New damping materials composed of piezoelectric and electroconductive particlefilled polymer composites: Effect of the electromechanical coupling factor [J].Die Makromol Chem. Rapid Communications,1991, 12(12):657661.
[3]Horid M,Aoki T, Ohira Y, et al. New type of mechanical damping composites composed of piezoelectric ceramics, carbon and epoxy resin [J].Composites Part A: Applied Science and Manufacturing,2001, 32(2):287290.
[4]Asmatulu R, Claus R O, Mecham J B, et al. Improving the damping properties of composites using ferroelectric inclusions [J]. Journal of Intelligent Material Systems and Structures, 2005, 16(5):463468.
[5]Hagood N W. Damping of structural vibrations with piezoelectric materials and passive electrical networks [J]. Journal of Sound Vibration, 1991, 146:243268.
[6]Yu J Y, Kaneko H, Sumita M. Electrical and dynamic mechanical behavior of BaTiO3/VGCF/LDPE composite [J].Composite Interfaces, 2001, 7:411424.
[7]Porfiri M, dellIsola F, Frattale Mascioli F M. Circuit analog of a beam and its application to multimodal vibration damping, using piezoelectric transducers [J].International Journal of Circuit Theory and Applications, 2004,32:167198.
[8]王晏研,陈喜荣,黄光速,等,CIIR/ACM/PZT/CB复合材料的阻尼性能 [J]. 高分子材料科学与工程,2005, 21(3):246249.
[9]李邓化,张良莹,姚熹.压电陶瓷相体积分数对13型压电复合材料性能的影响 [J].电子元件与材料,1999,18(4): 2426.
[10]晏雄,张慧萍,住田雅夫.应用压电陶瓷的减振复合材料研究 [J].中国纺织大学学报,2000,26(2):2932.
[11]郭栋,李龙土,桂治轮.陶瓷聚合物压电复合材料的最新进展 [J].高分子材料科学与工程,2001,17(6):4447.
[12]过梅丽.高聚物与复合材料的动态力学热分析 [M].北京:化学工业出版社,2002.2025.
[13]王艳秋.橡胶材料基础 [M].北京:化学工业出版社,2006. 216224
[1]陈林,刘立峰,李珍,等.不同埋烧氛围BNKT5陶瓷的结构与性能[J].武汉工程大学学报,2009,(12):59.
CHEN Lin,LIU Li feng,LI Zhen,et al.Structure and properties of BNKT5 ceramics prepared under different atmosphere of burying sintering[J].Journal of Wuhan Institute of Technology,2009,(02):59.