[1]朱朝晖,芦丁.修饰碳糊电极测定微量的铜离子[J].安徽化工,2006,32(1):6870.
[2]Xia Jianjun,Wei Wanzhi,Hu Yanbo,et al.A novel voltammetric method for the direct determination of copper in complex environmental samples[J].Anal Sci,2004,20:10371041.
[3]卢爱民,柴辛娜,高宏宇,等.溶剂萃取石墨炉原子吸收光谱法测定水样中的痕量铅[J].分析科学学报,2006,22(2):190192.
[4]Abbaspour A,Moosavi S M M.Chemically modified carbon paste electrode for determination of copper(II)by potentiometric method[J].Talanta,2002,56(1):9196.
[5]李成国,毕亚凡,柴利勇.纳米ZrO2的合成及其对稀土元素Yb的吸附行为研究[J].科技创新导报,2009,36(1):8081.
[6]Vassileva E,Proinova I,Hadjiivanov K. Solidphase extraction of heavy metal ions on a high surface area titanium dioxide (anatase). Analyst, 1996, 121(5):607.
[7]常刚,江祖成,彭天右,等. 溶胶—凝胶法制备高比表面积的纳米氧化铝及其对过渡金属离子吸附行为的研究 [ J ].化学学报,2003,61(1):100103.
[8]汪瑾,许煜汾.超细粉体在液相中分散稳定性的研究[J].合肥工业大学学报,2002,25(1):123126.
[1]余训民,金虹,胡丽军,等.电镀污泥中铜的浸出工艺及其动力学[J].武汉工程大学学报,2014,(11):1.[doi:103969/jissn167428692014011001]
YU Xun min,JIN Hong,HU Li jun,et al.Leaching process and kinetics of copper electroplating sludge[J].Journal of Wuhan Institute of Technology,2014,(05):1.[doi:103969/jissn167428692014011001]
[2]吴凤麒,祁 康,黄华良*.薄层液膜下外加直流电场对Cu/Ag电偶腐蚀行为的影响[J].武汉工程大学学报,2022,44(03):266.[doi:10.19843/j.cnki.CN42-1779/TQ.202112002]
WU Fengqi,QI Kang,HUANG Hualiang*.Effect of External Direct Current Electric Field on Galvanic Corrosion Behavior of Cu/Ag Under Thin Electrolyte Layer[J].Journal of Wuhan Institute of Technology,2022,44(05):266.[doi:10.19843/j.cnki.CN42-1779/TQ.202112002]