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[1]胡立嵩,郭俊芳*,索宝霞,等.差示扫描量热法研究环氧端基酚酞聚芳醚酮的固化特性[J].武汉工程大学学报,2013,(11):49-52.[doi:103969/jissn16742869201311011]
　HU Li\|song,GUO Jun\|fang,SUO Bao\|xia,et al.Curing characteristics of epoxy resin terminated phenolphthalein polyaryletherketone using differential scanning calorimetry[J].Journal of Wuhan Institute of Technology,2013,(11):49-52.[doi:103969/jissn16742869201311011]
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差示扫描量热法研究环氧端基酚酞聚芳醚酮的固化特性(/HTML)
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《武汉工程大学学报》[ISSN:1674-2869/CN:42-1779/TQ]

卷:
期数:
2013年11
页码:
49-52
栏目:
资源与土木工程
出版日期:
2013-11-30

文章信息/Info

Title:
Curing characteristics of epoxy resin terminated phenolphthalein polyaryletherketone using differential scanning calorimetry
文章编号:
16742869(2013)11004904
作者:
胡立嵩1; 郭俊芳2*; 索宝霞2; 鄢国平2
1.武汉工程大学环境与城市建设学院，湖北 武汉430074；2.武汉工程大学材料科学与工程学院，湖北 武汉430074
Author(s):
HU Li\|song1; GUO Jun\|fang2; SUO Bao\|xia2;  YAN Guo\|ping2
1.School of Environment and Civil Engineering, Wuhan Institute of Technology, Wuhan 430074, China; 2. School of Materials Science and Engineering, Wuhan Institute of Technology, Wuhan 430074, China
关键词:
环氧端基低聚物; 差示扫描量热法; 聚芳醚酮; 固化反应
Keywords:
epoxy\|terminated oligomer;  differential scanning calorimetry technique; polyaryletherketone;  kinetics of curing reaction
分类号:
TQ325
DOI:
103969/jissn16742869201311011
文献标志码:
A
摘要:
为了提高环氧树脂的力学性能和耐热性能，制备了环氧端基酚酞聚芳醚酮，并研究其固化反应.由酚酞和4, 4’\|二氟二苯酮经芳香亲核缩聚反应，制得了含酚氧钾端基的聚芳醚酮低聚物.将其与环氧氯丙烷反应得到环氧值为0.13、数均分子量为1 540的含环氧端基聚芳醚酮.利用差示扫描量热法研究了以4, 4’\|二氨基二苯醚为固化剂制备的环氧封端酚酞聚芳醚酮的固化反应和反应动力学特征.结果表明，固化反应为复杂反应，反应过程中体系放热，反应放热峰的起始温度和峰顶温度随着升温速率的增加而升高；该环氧体系的最低固化反应温度和固化反应峰顶温度为120.6 ℃和146.8 ℃，固化反应表观活化能和固化反应级数分别为68.21 kJ/mol和0.91.
Abstract:
To improve mechanical properties and heat resistance of epoxy resin, epoxy\|terminated phenolphthalein polyaryletherketone (E\|PEK) was synthesized by reaction of epichlorohydrin with Poly(ether ketone) oligomer having potassium phenoxide terminal group prepared by condensation of phenolphthalein with 4,4’\|difluorobenzophenone. E\|PEK has number\|average molecular weight and epoxy value of 1 540 g/mol and 0.13, respectively. E\|PEK was cured with 4,4’\|diaminodiphenyl ether and the cure kinetics was investigated by differential scanning calorimetry technique. The results show that the curing reaction is a kind of exothermic reaction, the initial temperature and curing temperature of curing exothermic peak elevate with the increase of heating rate; the lowest temperature of curing reaction is 120.6 ℃, the activation energy and curing reaction order are 68.21 kJ/mol and 0.91, respectively．

参考文献/References:

［1］Mohamed Heba A, Ibrahim Mervat S, Kandil Nadia G. Aromatic amine\|epoxidized sunflower free\|fatty\|acid adducts as corrosion inhibitors in epoxy\|curable varnishes ［J］. J Appl Polym Sci, 2012, 124(3): 2007\|2015. ［2］梁利岩，郑一泉，任少平，等. 一种长侧链取代液晶环氧单体的酸酐固化与性能［J］. 高分子材料科学与工程，2008, 24(9):127\|130.LIANG Li\|yan,ZHENG Yi\|quan,REN Shao\|ping,et al.Curing Reaction and Mechanical Properties of a LC Epoxy Monomer with Long Lateral Substituent Cured with Anhydride ［J］. Polymer Materials and Engineering, 2008, 24(9): 127\|130. (in Chinese)［3］Nguyen D, Cohendoz S, Mallarino S.Effects of curing program on mechanical behavior and water absorption of DGEBA/Teta epoxy network ［J］. J Appl Polym Sci, 2013, 129(5): 2451\|2463.［4］孙攀，史翎，张军营.可溶性聚醚醚酮改性环氧树脂的研究［J］. 北京化工大学学报：自然科学版, 2011, 38(2):36\|39.SUN Pan,SHI Ling,ZHANG Jun\|ying.Study of Expoxy Resins Modified by Soluble Poly(ether ether ketone) and Poly (ether ether ketone)［J］.Journal of Beijing University of Chemical Technology：Natural Science,2011, 38(2):36\|39.(in Chinese)［5］WANG J Y, YANG S Y, HUANG Y L, et al. Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials ［J］. J Appl Polym Sci,2012,124(3):2615\|2624.［6］Kissinger H E. Reaction kinetics on differential thermal analysis ［J］.Anal Chem,1957,29(11):1702\|1706．

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备注/Memo

备注/Memo:
收稿日期：20130806基金项目：国家自然科学基金资助项目(21001085);湖北省自然科学基金资助项目(2010CDB11104);武汉工程大学博士启动基金(11105032)作者简介：胡立嵩（1971\|），男，湖北武汉人，副教授.研究方向：环境工程、环境影响评价.*通信联系人
更新日期/Last Update: 2013-12-03