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[1]余训民,金虹,胡丽军,等.电镀污泥中铜的浸出工艺及其动力学[J].武汉工程大学学报,2014,(11):1-6.[doi:103969/jissn167428692014011001]
　YU Xun min,JIN Hong,HU Li jun,et al.Leaching process and kinetics of copper electroplating sludge[J].Journal of Wuhan Institute of Technology,2014,(11):1-6.[doi:103969/jissn167428692014011001]
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电镀污泥中铜的浸出工艺及其动力学(/HTML)
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《武汉工程大学学报》[ISSN:1674-2869/CN:42-1779/TQ]

卷:
期数:
2014年11期
页码:
1-6
栏目:
资源与土木工程
出版日期:
2014-11-30

文章信息/Info

Title:
Leaching process and kinetics of copper electroplating sludge
文章编号:
16742869(2014)011000106
作者:
余训民1; 金虹1; 胡丽军2; 黄雯琦1; 王术智1
1.武汉工程大学化学与环境工程学院，湖北 武汉 4300742.武汉格林环保设施运营有限公司，湖北 武汉 430050
Author(s):
YU Xunmin1; JIN Hong1; HU Lijun2; HUANG Wenqi1; WANG Shuzhi1
1.School of Chemical and Environmental Engineering，Wuhan Institute of Technology，Wuhan 430074， China2.Wuhan Green Environmental Protection Facilities Operation CO.,Ltd.,Wuhan 430050,China
关键词:
电镀污泥; 铜; 硫酸; 浸出工艺; 动力学
Keywords:
electroplating sludge;  copper;  sulfuric acid;  leaching process;  kinetics
分类号:
X703
DOI:
103969/jissn167428692014011001
文献标志码:
A
摘要:
以硫酸为浸出剂，对某表面处理工业园电镀废水处理污泥中的铜做了浸出试验研究.将污泥干燥、研磨， X射线衍射和X射线能谱仪分析表明污泥中含铜19.03%.采用单因素优化试验探讨了固液比、反应时间、浸出温度、硫酸质量分数、搅拌速度对铜浸出率的影响.结果表明：当硫酸质量分数为20%，固液比为1∶10，搅拌速率为700 r/min时，在20 ℃下反应40 min，铜的浸出率可达97%以上；根据未反应核收缩模型，对硫酸浸铜过程的动力学机理进行了研究，结果表明：硫酸浸铜过程的控制步骤为固体膜扩散控制，其反应级数为0.828 2，浸出活化能为11.809 kJ/mol.研究为含铜电镀污泥安全处置提供理论依据.
Abstract:
The experiment was carried out for leaching copper from sludge of electroplating wastewater in a surface treatment industrial park using sulfuric acid as the leaching agent. The sludge was dried and grinded and it’s main components were analyzed by using Xray diffraction and Xray energy spectrometer. Result shows that the sludge contains 19.03% copper. The effects of sulfuric acid concentration, solidtoliquid ratio, reaction time, temperature and stirring speed on the leaching rate of copper were discussed. The results show that the leaching rate of copper is 97% under the conditions of sulfuric acid mass fraction of 20% , solidtoliquid ratio of 1:10, stirring speed of 700 r/min, reaction time of 40 min and temperature of 20 ℃. The kinetics of the copperleaching process was studied according to the unreaction shrinking core model. The results indicate that the leaching rate of copper is mainly controlled by the solid membrane diffusion rate, in which reaction order is 0.828 2 and leaching activation energy is 11.809 kJ/mol. The study provides a theoretical basis for a safe disposal of copper electroplating sludge.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期：20141011基金项目:武汉工程大学研究生教育创新基金(CX2013108）作者简介：余训民（1957），男，湖北监利人，教授，硕士研究生导师．研究方向：废物资源化利用和水环境化学污染控制．
更新日期/Last Update: 2014-12-08